AMAOE NET 50 STENCINL For NTE ARM BGA208 Stencil is a high-precision reballing tool specially developed for motherboard IC repair of the smartphone. Manufactured with durable, heat-resistant stainless steel, this stencil ensures accurate alignment and smooth solder paste deposition for BGA rework. Its laser-cut micro-holes perfectly match the original pad layout of key ICs on the board, ensuring efficient solder ball planting and preventing bridging or paste overflow. This stencil supports both hot air and reflow methods, making it suitable for professional technicians working with CPU, PMIC, NAND, audio IC, charging IC, network IC, RAM, and other micro components. Designed for repeated use, the stencil delivers strong rigidity, reduced warping under heat, and excellent tin absorption, providing stable performance even in heavy repair environments. For mobile repair shops, it guarantees faster workflow, higher success rates, and cleaner solder joints on sensitive components.
