$38.62
$64.88
Jtx T4 Pro Chips Glue Removal And Reballing Platform For IOS And Android Features: T4 Pro degumming and tin planting platform, support Apple/Huawei/OPPO/VIVO/Honor/Xiaomi/Samsung and other models, a total of 84 models of chips The 2-in-1 design greatly helps the maintenance master save costs and improve tin plant efficiency Magnetic automatic clamping, universal 3D planting tin net, removing glue card, accurate positioning Clamping precision, more stable operation, not easy to damage the chip Using a new type of magnetic dynamic positioning, strong magnetic clamping stable, automatic alignment It has wear-resistant, anti-slip, shock-absorbing, anti-aging, non-toxic tasteless and high temperature resistance Selected high-quality steel, fine workmanship, wear resistance, high hardness Support tin planting Support unlimited expansion, a total of 84 types of chips Supported models:- Qualcomm: MSM8909/8905, MSM8916/8939, MSM8917, MSM8953, MSM8953 1AB, MSM8937/8940, MSM8996, SM8150, SM8250, SM8250-002, SM8350, SM8450, SM8475, SM8550, SM8650, SM6115, SM7225-00AB, SM7250, SM7325, SM7350, SDM439, SDM636, SDM710, SDM845, SM665, SM6150, SM8750, SM730G, SM7150,SM680, SM6225, SM7475, SM6450, SM720, SM7125 Dimensions: MT6761V/6762V/6765V, MT6885Z, MT6895Z, MT6893Z, MT6855V, MT6853V, MT6877V, MT6769V, MT6873V, MT6833V, 1100/1200, 9200, 9300 Android RAM: BGA 376, BGA 436, BGA 496, BGA 556 Samsung Exynos: 990, 8895, 980, 2100, 2200, 9820 Huawei Hisilicon: HI3660, HI9290/L, HI6280, HI3690 5G, HI3680, HI36A0, HI3670, HI36A0, HI6260, HI3690 4G Apple: A8, A9, A10, A11, A12, A13, A14, A15, A16, A17, A18, A18 Pro Packaging Details' : 1 x Fixture 14 x Stencil
Jtx
